Writing nowTrack 1, Compiler Internals, Memory Anatomy & Optimization Forensics. Tentative Q4 2026.
Embedded Institute Free AI prompt pack

Track 5 · Planned · Tentative Q2 2027

Headless CI/CD, Containerized Toolchains & Virtual Bench (HIL)

Reproducible builds and automated tests for firmware, with and without hardware.

Track 5 isn’t on sale yet. It opens for pre-order when writing starts, with release planned for Q2 2027.

I need Track 5 sooner

Tracks are written in order. Requests with a real deadline help decide which track gets moved up.

Release emails for Track 5

One email each time a module in this track ships.